TSMC to Start Risk Production Using 4nm Node in Q3

Taiwan Semiconductor Manufacturing Co. is on track to start risk production of chips using its N4 (4 nm) fabrication technology in the third quarter, according to TSMC and DigiTimes’ sources in the semiconductor supply chain. The new node will enable chipmakers to slightly shrink the N5 design and further optimize power consumption and performance in 2022.

(Image credit: TSMC)

TSMC’s N4 belongs to the company’s N5 family that also includes N5, N5P, and N5HPC. While all of these technologies rely on both deep ultraviolet lithography (DUV) and extreme ultraviolet lithography (EUV), as well as have many things in common, they are still quite a bit different and are designed for differing applications.

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TSMC

(Image credit: TSMC)

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