TSMC Exploring On-Chip, Semiconductor-Integrated Watercooling


TSMC, at the VLSI symposium, recently presented its investigations into on-chip watercooling as a way to battle issues with heat dissipation. And it involves integrating water channels straight into the chip’s design. 

As transistors get increasingly compressed together due to denser manufacturing technologies and added vertical 3D chip stacking, temperature becomes an increasingly critical problem to address. TSMC’s researchers think the solution is allowing water to flow in-between sandwiched circuits. It’s an incredibly simple theoretical solution, but is an extremely difficult engineering feat to pull off safely –for the electronics, that is.



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